Soloplan at the “bonding” fair at TU Dresden

Soloplan is an exhibitor at the “bonding” fair in Dresden on Tuesday, 18 April 2023. You are cordially invited to visit us at booth F6. The event will take place at TU Dresden from 09:30 to 16:30. Visitors will have the chance to obtain information about a wide range of different professions and get to know potential employers personally.

This is already Soloplan’s 18th time at the recruitment fair at the Technical University in Dresden. Our team is available for many conversations and can answer various questions all about the career opportunities at Soloplan. Get a first-class look at our diverse offer ranging from internships, working-student jobs and degree theses to the start of your career–on 18 April 2023.

As an IT service provider in the logistics sector, we offer students from the areas of computer science, transport science and business administration exciting jobs in an internationally-oriented family business.

We are looking forward to good conversations!

You are not able to come this year? No problem! You can find out more about your career opportunities at Soloplan here.